LS550G

In the world of embedded GNSS, a new generation of ultra-compact, ultra-low-power modules opens up unprecedented possibilities for portable and wearable devices.
A SiP design of just 5×5 mm, integrating SAW, LNA, TCXO, RTC and Flash, all in a thickness of 1.05 mm, now enables thinner products without compromising on performance.

Despite this minimalist format, the module provides full multi-constellation reception: GPS, GLONASS, Galileo, BDS, QZSS.
Results: reduced TTFF, tracking at just 10 mW, acquisition at 27 mW, robust operation in urban canyons, and EPO / A-GNSS compatibility for optimized sensitivity.

The 0.45 mm LGA format makes assembly easier than with a traditional IC, while guaranteeing excellent stability with different antenna topologies.
On-board Flash memory simplifies logging and firmware updates.

An evaluation kit is also available to speed up development.

It's the ideal building block for all applications looking for a miniature, high-performance GNSS with low power consumption.

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