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Industrial boards

Thanks to its partnerships, Syscom-Prorep offers you the widest range of industrial boards, from SBC (1.8'' , 2.5'', 3.5'' or 4'') to standard (NUC, Mini-ITX, uATX or ATX). We present the latest products recommended by our manufacturers for your new designs. For more information, please contact our specialists.

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Recommended
by Syscom Prorep

AIMB-787

Intel® 10th generation Core™ i9/i7/i5/i3/Pentium®/Celeron® processor with Q470E chipset Four DIMM sockets up to 128 GB DDR4 2933 Triple display DP/DVI-D/VGA and dual GbE LAN M.2, SATA RAID 0, 1, 5, 10, USB 3.2 Supports Intel vPro, AMT & TPM technologies Note 1: TPM module is required to enable Intel vPro and TPM technologies. Note 2: Legacy platform is not supported.

Type of architecture
x86
Processor type
Intel Core
Heat dissipation
Active
Temperature range
Standard
Form factor
ATX
Length
305
Width
244
Recommended
by Syscom Prorep

RSB-4680

Rockchip ARM Cortex-A17 RK3288 Quad Core, up to 1.6GHz Onboard 2GB DDR3L memory and 8GB eMMC HDMI 3840x2160 at 60Hz, VGA 1920x1200 at 60Hz, Dual Channel 18/24/30 bit LVDS Support 4K H.264/H.265 Video decoder 6 UART, 6 USB2.0, 1 GbE, 8 GPIO, 1 MIPI CSI, 1 SPI M.2 for WIFI/BT support, mini-PCIe for 3G/4G support

Type of architecture
ARM
Processor type
ROCKCHIP
Heat dissipation
Passive
Temperature range
Standard & Industrial
Form factor
SBC 3.5"
Length
146
Width
102
Recommended
by Syscom Prorep

SV-33DB6

Rockchip RK3399 CPU 2/4G Memory, 16/32/64G eMMC on board 6*COM, 7*USB, 2*GbE LAN Supports Dual display of HDMI, eDP and LVDS/eDP Wifi+BT Module on board, 1*Mini-PCIe (3G/4G) 3.5", DC 12V Power Input

Type of architecture
ARM
Processor type
ROCKCHIP
Heat dissipation
Passive
Temperature range
Standard
Form factor
SBC 3.5"
Length
146
Width
105
Recommended
by Syscom Prorep

MS-9892

Intel® Apollo Lake/Apollo Lake-I Series SoC 2 DDR3L 1866 MHz SODIMM slots up to 8GB Triple independent displays : DP, HDMI, LVDS/eDP 2 GbE LAN with RJ-45 1 PCIe x1 (Gen 2), 1 Mini-PCIe (Full/Half size, with SIM Holder), 1 Mini-PCIe (Full size, with mSATA) slots mSATA, 2 SATA 3.0 for storage 4 USB 3.2 Gen 1, 6 USB 2.0, 6 COM (2 RS-485), GPIO, PS/2, Audio, S/PDIF, System FAN Onboard TPM 2.0 SMBus, Chassis Intrusion Wide operating temperature : -40~85°C (by option) Wide Voltage DC-IN 12~24V

Type of architecture
x86
Processor type
ATOM
Heat dissipation
Passive
Temperature range
Standard & Industrial
Form factor
Mini-ITX
Length
170
Width
170
Recommended
by Syscom Prorep

PCA-6029

Supports Intel® Core™ i7/i5/i3 LGA1151 processors with H110 chipset Dual Channel (Non-ECC) DDR4 1866/2133 up to 64 GB Supports USB 3.0, SATA3.0 Dual display with VGA and DVI-D/DP (optional) Supports Advantech LPC modules Supports SUSIAccess and embedded software APIs

Type of architecture
x86
Processor type
Intel Core
Heat dissipation
Active
Temperature range
Standard
Form factor
PICMG
Length
338
Width
222
Recommended
by Syscom Prorep

SV3B-13526

11th Intel Core/ Celeron CPU (Tiger Lake) 2*Intel GbE LAN, 6*USB 3.0, 6*COM, 2*HDMI 3*M.2, SSD support, WiFi+BT, 4G/5G Support Triple display of 2*HDMI and 1*LVDS/eDP 3.5'', CPU at the solder side of M/B, DC 12V Power Input

Type of architecture
x86
Processor type
Intel Core
Heat dissipation
Passive
Temperature range
Standard
Form factor
SBC 3.5"
Length
146
Width
102
Recommended
by Syscom Prorep

AIMB-785

Supports Intel® 6th and 7th Core™ i7/i5/i3/Pentium/Celeron processor withQ170 chipset Four DIMM sockets support up to 64 GB DDR4 1866/2133 Supports triple display VGA/2 DVI-D and dual GbE LAN Supports SATA RAID 0, 1, 5, 10, USB 3.0 Supports Intel vPro, AMT 11.0 & TPM technologies Note 1: TPM module is required to enable Intel vPro and TPM technologies. Note 2: Intel 7th generation processors only support Windows 10 (64-bit).

Type of architecture
x86
Processor type
Intel Core
Heat dissipation
Active
Temperature range
Standard
Form factor
ATX
Length
305
Width
244
Recommended
by Syscom Prorep

SV-33B54

Rockchip RK3399 CPU 2/4G Memory, 8/16/32/64G eMMC on board 4*COM, 4*USB, 1*GbE LAN, 1*RJ11 Supports Dual display of HDMI, eDP, LVDS/eDP, MIPI-DSI Wifi+BT Module on board, 1*USB Header (3G/4G) 1*FPC (3*COM, 1*USB, 2*GPIO) 3.5", DC 24V Power Input

Type of architecture
ARM
Processor type
ROCKCHIP
Heat dissipation
Passive
Temperature range
Standard
Form factor
SBC 3.5"
Length
146
Width
105
Recommended
by Syscom Prorep

MIO-2363

Intel Atom x6000E Series Onboard LPDDR4x up to 8GB and EMMC up to 128GB Support 12-24V wide voltage range -40~85°C operating temperature 2x GbE LAN, 2x USB3.2, 2x RS-232/422/485, I2C M.2 E-Key, M.2 B-Key for SATA storage and option to support RS-232 module Support iManager & Software APIs, WISE-DeviceOn, and EdgeAI Suite

Type of architecture
x86
Processor type
ATOM
Heat dissipation
Passive
Temperature range
Standard
Form factor
Pico-ITX (2.5)
Length
100
Width
72
Recommended
by Syscom Prorep

MS-98H5

Intel® Apollo Lake/Apollo Lake-I Series SoC LPDDR4 2133 MHz onboard memory up to 8GB Triple independent displays: DVI-D, HDMI 1.4 (DP by option), LVDS 2 PoE/GbE LAN with RJ-45 (IEEE 802.11af compliant) 1 Mini-PCIe (Full size, with NANO SIM-Holder), 1 M.2 B Key (with NANO SIM-Holder) SATA 3.0, M.2 M Key for storage 4 USB 3.2 Gen 1, 4 USB 2.0, 6 COM (2 RS-485), GPIO, Audio Onboard TPM 2.0 (by option) ESD: Contact 6KV/ Air 8KV Dual channel CANBus 2.0B Wide operating temperature : -40~85°C Wide voltage DC-IN 12~48V

Type of architecture
x86
Processor type
ATOM
Heat dissipation
Passive
Temperature range
Standard & Industrial
Form factor
EPIC
Length
165
Width
115
Recommended
by Syscom Prorep

RSB-4810

Rockchip RK3568 Arm Quad Cortex-A55, up to 2.0GHz Built-in NPU with processing performance of up to 1.0 TOPS Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC Supports 1 x HDMI 2.0 4K, 1 x LVDS/MIPI-DSI, and 1 x eDP Supports 4K H.264/H.265 video decoder Provides 2 x GbE, 1 x SATA 3.0, 6 x UART, 2 x USB 3.0, 2 x USB 2.0, 1 x USB OTG, and 2 x CAN FD Provides a M.2 E Key with PCIE 3.0/USB 2.0/SDIO/UART signal for Wi-Fi 5/6 Modules, and a MINI-PCIE with PCIE 3.0/USB 2.0 signal for LTE/5G Modules Supports Linux and Android OS

Type of architecture
ARM
Processor type
ROCKCHIP
Heat dissipation
Passive
Temperature range
Standard & Industrial
Form factor
SBC 3.5"
Length
146
Width
102
Recommended
by Syscom Prorep

QBiP-2718A

3.5'' SBC AMD Ryzen™ V2718 Embedded Processor Dual Channel DDR4, 2 x SO-DIMMs 2 x GbE LAN Ports 1 x SATA 6Gb/s Port M.2 with SATA 6Gb/s or PCIe x4 4 x HDMI 2.1, eDP ports for multiple display 2 x COM Ports (RS-232/422/485 & RI/5V/12V) 2 x COM Ports (RS-232)

Type of architecture
x86
Processor type
AMD
Heat dissipation
Passive
Temperature range
Standard
Form factor
SBC 3.5"
Length
146
Width
102
Recommended
by Syscom Prorep

SBC3500

High performance Quad-core ARM Cortex-A55 (64-bit ARMv8) Hardware decoder up to 4K@60fps and encoder to 1080P@100fps or 4K@10fps Hardware 2D/3D graphics accelerator Multiple display interfaces (HDMI, eDP, LVDS or MIPI-DSI TX) Multiple camera interfaces (MIPI-CSI RX, USB) Rich set of peripherals (USB3.0, 2.0, LAN, CAN-FD, GPIO, I²C, SPI, etc.) Preinstalled Linux or Android OS

Type of architecture
ARM
Processor type
ROCKCHIP
Heat dissipation
Passive
Temperature range
Standard & Industrial
Form factor
SBC 3.5"
Length
150
Width
102
Recommended
by Syscom Prorep

SBC3100

High performance 2xARM Cortex-A72 + 4xARM Cortex-A53 cores Dedicated hardware decoder up to 4Kx2K@60fps and encoder to 1080p@30fps Hardware 2D/3D graphics accelerator Multi-diplay interfaces (HDMI, eDP, MIPI-DSI) Multi-camera interfaces (MIPI-DSI, USB) Rich set of peripherals (USB3.0, USB2.0, LAN, Buzzer, GPIO, I2C...etc) Preinstalled Linux or Android OS

Type of architecture
ARM
Processor type
ROCKCHIP
Heat dissipation
Passive
Temperature range
Standard & Industrial
Form factor
SBC 3.5"
Length
150
Width
102
Recommended
by Syscom Prorep

PCE-7132

Intel® Xeon® W Family/Core™ i9/i7/i5/i3 LGA1200 processor with W480E chipset Up to 64 GB of dual-channel (non-ECC) DDR4 2666/2933 MHz PCIe 3.0, M.2, USB 3.2, SATA 3.0, and SW Raid 0, 1, 5, 10 Supports VGA and 2 x DVI-D/DP display (with optional cable) Supports out-of-band remote management with AMT Supports Advantech's LPC modules, SUSIAccess, and embedded software APIs

Type of architecture
x86
Processor type
Intel Core
Heat dissipation
Active
Temperature range
Standard
Form factor
PICMG
Length
338
Width
222
Recommended
by Syscom Prorep

AIMB-707

Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with H420E chipset Dual channel (Non-ECC) DDR4 2400/2666/2933 up to 64 GB Support VGA and DVI display M.2, SATA 3.0, USB 3.2, dual GbEs 5 RS-232 and 1 RS-232/422/485 serial ports 1 PCIe x16 (Gen 3) and 2 PCIe x4 (x1 Gen 3 link), and 4 PCI expansion slots Note: Legacy platform is not supported.

Type of architecture
x86
Processor type
Intel Core
Heat dissipation
Active
Temperature range
Standard
Form factor
ATX
Length
305
Width
244
Recommended
by Syscom Prorep

pITX-MX8M-PLUS

NXP iMX8M Plus LPDDR4 2133Mhz On Board up to 4GB and On Board 16GB eMMC Triple independant display HDMI, LVDS and mipi-DSI 2xGbE LAN 2xUSB3.1 and 1xUSB client 1xM.2 KeyE and 1xmPCIe 50 pin expansion IO (2xCAN,1xUSB3.1,3xUSB2.0,4xUARTs,1xSPI,2xI2C,6GPIOs) 12VDC Power Supply

Type of architecture
ARM
Processor type
NXP
Heat dissipation
Passive
Temperature range
Standard & Industrial
Form factor
SBC 2.5"
Length
100
Width
72
Recommended
by Syscom Prorep

PCE-5032

Intel® Core™ i9/i7/i5/i3 LGA1200 processor with H420E chipset Up to 64 GB of dual-channel (non-ECC) DDR4 2666/2933 MHz PCIe 3.0, USB 3.2, and SATA 3.0 slots Supports VGA and DVI-D/DP display (with optional cable) Supports Advantech's LPC modules, SUSIAccess, and embedded software APIs

Type of architecture
x86
Processor type
Intel Core
Heat dissipation
Active
Temperature range
Standard
Form factor
PICMG
Length
338
Width
222
Recommended
by Syscom Prorep

QBiP-1605B

3.5'' SBC AMD Ryzen™ V1605B Embedded Processor Dual Channel DDR4, 2 x SO-DIMMs 2 x GbE LAN Ports 1 x SATA 6Gb/s Port M.2 with SATA 6Gb/s or PCIe x4 4 x HDMI 2.0, eDP ports for multiple display 2 x COM Ports (RS-232/422/485 & RI/5V/12V) 2 x COM Ports (RS-232)

Type of architecture
x86
Processor type
AMD
Heat dissipation
Passive
Temperature range
Standard
Form factor
SBC 3.5"
Length
146
Width
102
Recommended
by Syscom Prorep

RSB-3720

NXP Arm® Cortex®-A53 i.MX8M Plus Quad/Dual up to 1.8 GHz Onboard LPDDR4 4 GB / 6 GB, 4000MT/s memory HDMI 1920x1080 at 60Hz, 1 Single or 1 Dual Channel 24 bit LVDS (or 1 4-Lane MIPI-DSI by BOM Option) 1 4-wire RS-232/422/485, 1 USB3.2 Gen1 By 1, 1 USB2.0, 1 Micro SD, 1 Mic. in / Line out 1 mini-PCIe for 3G/4G, 1 M.2 2230 Key E Slot Supports Yocto Linux and Android Support I/O Expansions boards by UIO40-Express

Type of architecture
ARM
Processor type
NXP
Heat dissipation
Passive
Temperature range
Standard & Industrial
Form factor
SBC 2.5"
Length
100
Width
72
Recommended
by Syscom Prorep

QBi-6412A

Embedded IPC Motherboard Intel® Celeron® J6412 Processor Single Channel DDR4, 1 x SO-DIMM 2 x GbE LAN Ports 1 x SATA 6Gb/s Port Ultra-Fast M.2 with PCIe Gen3 x4 Interface 2 x HDMI Ports for multiple display 1 x COM Port (RS-232)

Type of architecture
x86
Processor type
ATOM
Heat dissipation
Passive
Temperature range
Standard
Form factor
NUC
Length
100
Width
100
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